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PCB Plating Equipment

Innovative Technologies to Grow

the Global Semiconductor Industry

Next generation

PCB plating equipment

Innovative Technologies to Grow the Global Semiconductor Industry 

Next generation PCB plating equipment

PCB plating equipment


After chemically moving,

I'll officially put it on the PCB.


It is a process of copper plating in a designed circuit or hole.


The key is to plating evenly using DC.

It can be said to be the core of the PCB manufacturing process.

What is J-ONE 's next generation PCB plating technology?

Before electro-copper plating.

 (the process of plating by applying electricity)

 It is a process of copper plating in a circuit or hole designed on a PCB with a thickness of about 2um.

 It can be said that it is a process of plating in advance in order to make electric copper plating better.

breakthrough technology in the semiconductor industry

Advantages and Effects of Next Generation PCB Plating

 What is J-ONE 's next generation PCB plating technology?

Before electro-copper plating (the process of plating by applying electricity) 

It is a process of copper plating in a circuit or hole designed on a PCB with a thickness of about 2 μm.

It can be said that it is a process of plating in advance in order to make electric copper plating better.

Plating thickness deviation, which is a limitation of existing PCB plating facilities, at least in a way It can improve the quality of the PCB and significantly reduce the defect rate

It can be plated with a certain thickness compared to the existing equipment. PCB microcircuit process capability and productivity have been significantly improved

It automates the entire process in a contactless manner and provides surface treatment technology. Productivity, maintenance, and safety are all secured by applying new construction methods

breakthrough technology in the semiconductor industry

Types and processes of the next generation PCB plating process

Plating thickness deviation, which is a limitation of existing PCB plating facilities,

at least in a way It can improve the quality of the PCB and significantly

reduce the defect rate

It can be plated with a certain thickness compared to the existing equipment.

PCB microcircuit process capability and productivity have been significantly improved

It automates the entire process in a contactless manner and provides surface treatment technology. Productivity, maintenance, and safety are all secured by applying new construction methods

breakthrough technology in the semiconductor industry 

Types and processes of the next generation PCB plating process

Debrring


Remove foreign substances in the flexible copper foil during CNC processing.

A process of polishing copper plating on the surface of copper foil to improve adhesion. 


Brush -> wash with water -> ultrasonic wash -> dry

Desmear


The inner layer of the hole where EPOXY RESIN melts due to high heat of CNC DRILL HOLE fabrication Process to remove SMEAR attached to copper foil cross section


Speller -> Scrubber -> Mesh -> Scrubber -> Neutral -> Scrubber -> Dry

Desmear


The inner layer of the hole where EPOXY RESIN melts due to high heat of CNC.

DRILL HOLE fabrication Process to remove SMEAR attached to copper foil cross section


Speller -> Scrubber -> Mesh -> Scrubber -> Neutral -> Scrubber -> Dry

Electricless Cu Plating


Chemical copper plating is applied to the inner wall of the hole and the chomme of the product mark to enhance the conductivity of the inner wall of the hole. the process of attaching copper to be granted


skim -> wash with water -> soft specifications -> Pre-Dip -> Catalyst -> wash with water -> Redditor -> wash with water -> chemical copper -> wash with water

Electricless Cu Plating


Chemical copper plating is applied to the inner wall of the hole and the chomme of the product mark to enhance the conductivity of the inner wall of the hole.

the process of attaching copper to be granted


skim -> wash with water -> soft specifications -> Pre-Dip -> Catalyst -> wash with water -> Redditor -> wash with water -> chemical copper -> wash with water

Electric Cu Plating


by electrically plating the inner wall and surface of the hole plated with chemical copper the process of plating to the desired thickness


Sanji -> Electric copper -> Scrubber -> Byeongjeong -> Scrubber -> Dry

J-ONE solution Product Information

J-ONE KOREA is

It is a company with world-class semiconductor preservation and excellent engineering.

Through innovative research and development,

we provide the highest level of technology solutions.

Download the catalog >

J-ONE STORY

It is an innovative technology that grows

the global semiconductor industry.

J-ONE Solution Product Information 

J-ONE KOREA is..

It is a company with world-class semiconductor preservation and excellent engineering.

Through innovative research and development, we provide the highest level of technology solutions.

Download the catalog >

Number : 070-8778-8621

J-ONE STORY

It is an innovative technology that grows the global semiconductor industry.

J-ONE KOREA

Representative: Lim Ji hoon.

Call:  070-8778-8621

Address: 59-69,913 Seoul Daehak-ro, Siheung-si, Gyeonggi-do (Baegot-dong)